High temperature ultrasonic probe and pulse-echo probe mounting fixture for testing and blind alignment on steam pipes

ABSTRACT

A high temperature ultrasonic probe and a mounting fixture for attaching and aligning the probe to a steam pipe using blind alignment. The high temperature ultrasonic probe includes a piezoelectric transducer having a high temperature. The probe provides both transmitting and receiving functionality. The mounting fixture allows the high temperature ultrasonic probe to be accurately aligned to the bottom external surface of the steam pipe so that the presence of liquid water in the steam pipe can be monitored. The mounting fixture with a mounted high temperature ultrasonic probe are used to conduct health monitoring of steam pipes and to track the height of condensed water through the wall in real-time.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of U.S. provisionalpatent application Ser. No. 61/815,110, filed Apr. 23, 2013, andpriority to and the benefit of U.S. provisional patent application Ser.No. 61/815,191, filed Apr. 23, 2013, each of which applications isincorporated herein by reference in its entirety.

STATEMENT REGARDING FEDERALLY FUNDED RESEARCH OR DEVELOPMENT

The invention described herein was made in the performance of work undera NASA contract, and is subject to the provisions of Public Law 96-517(35 USC 202) in which the Contractor has elected to retain title.

FIELD OF THE INVENTION

The invention relates to ultrasonic measurements in general andparticularly to systems and methods that provide ultrasonic measurementson pipes.

BACKGROUND OF THE INVENTION

Water condensation in steam pipes can lead to potential accidents andsystem failures in a steam pipe system.

One of the concerns to such a system is the excitation of water hammerthat may lead to serious consequences including damaged vents, traps,regulators and piping. The water hammer is caused by accumulation ofcondensed water that is trapped in a portion of horizontal steam pipes.The fast flowing steam over the condensed water causes ripples in thewater creating buildup of turbulence and resulting in the waterformation of a solid mass or slug that fills the pipe. The slug of thecondensed water can travel at the speed of the steam striking the firstelbow that is encountered in its path. The force can be comparable to ahammer blow and can be sufficiently large to break the back of theelbow.

There is a need for monitoring systems and methods that sustains theconditions next to a steam pipe to be monitored in real time.

SUMMARY OF THE INVENTION

According to one aspect, the invention features a high-temperatureultrasonic probe. The high-temperature ultrasonic probe comprises apiezoelectric transducer element having a Curie temperature of at least350° C. and a mechanical damping (tan δ) of 0.02 or less; electricalinput terminals configured to receive a driving signal to thepiezoelectric transducer element; electrical output terminals configuredto provide a response signal from the piezoelectric transducer element;a preload flexure; and a probe housing.

In one embodiment, the high-temperature ultrasonic probe is configuredto perform pulse-echo measurements at a frequency of 2.25 MHz or higher.

In another embodiment, the ultrasonic probe is configured to act as bothan ultrasonic transmitter and an ultrasonic receiver.

In yet another embodiment, the high-temperature ultrasonic probe furthercomprises a backing.

In still another embodiment, the backing is configured to reduce theduration of a ringing in the piezoelectric probe element.

In a further embodiment, the backing is a selected one of air, a highimpedance polymer and a low impedance polymer.

In yet a further embodiment, the high-temperature ultrasonic probefurther comprises a preload offset.

In an additional embodiment, the high-temperature ultrasonic probefurther comprises a pulser/receiver and amplifier.

In one more embodiment, the high-temperature ultrasonic probe furthercomprises a digital signal processor.

In still a further embodiment, the high-temperature ultrasonic probefurther comprises a wireless communication module.

According to another aspect, the invention relates to a mounting fixturefor attaching a high-temperature ultrasonic probe to a steam pipe. Themounting fixture comprises a frame; a probe alignment guide connected tothe frame by way of a plurality of flexures; two strap pins attached tothe frame; three alignment bolts attached to the frame; and a strap.

In one embodiment, the probe alignment guide is configured to determinean axis of a high-temperature ultrasonic probe.

In another embodiment, the plurality of flexures are configured to keepthe high-temperature ultrasonic probe in contact with the steam pipe.

In another embodiment, the plurality of flexures are configured to keepthe orientation of the probe alignment guide constant while preloadingthe probe against the pipe and through temperature variations of thepipe and environment.

In yet another embodiment, the strap pins contain a spherical surfacefor strap pin mounting.

In still another embodiment, the strap pins comprise a selected one of apin joint, a ball joint and a sliding ball joint.

In a further embodiment, the three alignment bolts each have a sharpend.

In yet a further embodiment, the three alignment bolts are configured tobe independently adjusted to align the mounting fixture relative to alocal preferred direction.

In still a further embodiment, the local preferred direction is a localvertical direction.

The foregoing and other objects, aspects, features, and advantages ofthe invention will become more apparent from the following descriptionand from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the invention can be better understood withreference to the drawings described below, and the claims. The drawingsare not necessarily to scale, emphasis instead generally being placedupon illustrating the principles of the invention. In the drawings, likenumerals are used to indicate like parts throughout the various views.

FIG. 1 is a diagram that illustrates the health monitoring system andthe pulse echo method of measuring the condensed water height in a steampipe using time-of-flight of reflected ultrasonic waves.

FIG. 2A is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2B is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2C is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2D is a perspective view of the probe alignment fixture.

FIG. 2E is a cutaway view of the probe alignment fixture.

FIG. 3A is a perspective view of the probe and the connection fixturefor the mounting in the field.

FIG. 3B is a sectional view through the probe.

FIG. 3C is a cross-sectional plan view showing the pre-load offset.

FIG. 4A is an image of the pipe mounting strap elements.

FIG. 4B is an image of the pipe mounting strap elements and the halfpipe mounting strap and block.

FIG. 5 is an image of a mockup of a steam pipe with the strap and theprobe attached simulating operation in the field.

FIG. 6A is an image of a sliding ball joint for attaching the mountingstrap.

FIG. 6B is an image of a ball joint for attaching the mounting strap.

FIG. 6C is an image of a pin joint for attaching the mounting strap.

FIG. 7A is an image of a strap that has restricted circumferentialalignment capability.

FIG. 7B is another image of the strap shown in FIG. 7A.

FIG. 8 is a graph of the measured height of water in the simulation pipeusing a strapped probe at room temperature, with the actual height alsoindicated.

FIG. 9 is a schematic diagram illustrating the probe components (not toscale).

FIG. 10 is a graph that shows the temperature dependent dielectricproperties of conventional Type II and TRS203 ceramics.

FIG. 11 is an image of two examples of the fabricated thickness modehigh temperature piezoelectric probe.

FIG. 12A is a graph of the time-domain pulse-echo responses from a steelreflector in air, using probe A, probe B, and probe C.

FIG. 12B is a graph of the frequency-domain pulse-echo responses from asteel reflector in air, using probe A, probe B, and probe C.

FIG. 13 is an image of the high temperature (HT) test bed with saffloweroil where the probe was subjected to 250° C.

FIG. 14A through FIG. 14F are graphs of pulse-echo responses using anair-backed probe from the half steam pipe that contains silicon oil atvarious temperatures.

DETAILED DESCRIPTION

The problem that was addressed is the need to prevent failures in agingsteam pipe systems found in many places. An effective in-service healthmonitoring system is needed to track water condensation in real-timethrough the wall of the steam pipes. The system is required to measurethe height of the condensed water from outside the pipe while operatingat temperatures that are as high as 250° C. The system needs to accountfor the effects of water flow and cavitation. In addition, it is desiredthat the system does not require perforating the pipes and therebyreducing the structural integrity.

We describe an alignment fixture that allows for the blind alignment ofultrasonic pulse-echo probes for mounting on pipes. The strap with amounted probe is used to conduct health monitoring of steam pipes andtrack the height of condensed water through the wall in real-time.

The novel features of this disclosure are believed to include a novelmounting fixture design that allows alignment of ultrasonic pulse-echoprobe onto pipes, and a mounting fixture that allows for alignment ofpulse-echo probes without the use of reference reflection from condensedwater in steam pipes while testing thru the wall of the pipe.

The disclosed mounting fixture can be used for testing that involvesultrasonic pulse-echo testing of pipes. We identified materials that cansustain performance at high temperatures that enable this invention.

The ultrasonic pulse-echo probe can sustain temperatures as high as 250°C. It uses a piezoelectric transducer to generate and receive theultrasonic pulses. The transducer is made of a material with high Curietemperature (denoted by T_(C) and the probe is configured such that itis operated as an air-backed transducer that has minimum losses ofpower. The probe needs to be mounted in a manhole under high humidity(80%) and temperature conditions (higher than 70° C.). Underconventional procedures, the high temperature of the pipe cures thecurrently used couplant (or adhesive) in seconds. This does not allowfine adjustment of the probe orientation. The fixture that is describedallows for the alignment of the mounting fixture first and theninsertion and preloading of the probe without the need to performfurther alignment. The feasibility of the disclosed mounting fixture wasdemonstrated in the lab.

The probe and its mounting fixture are important parts of a healthmonitoring of steam pipes that is being developed. A high temperaturepiezoelectric transducer generates and receives ultrasonic waves. In apreferred embodiment, the probe transmits the wave normal to the pipesurface. The mounting fixture was designed to allow for alignment of theprobe even without a reference reflection and thus enables “blind”alignment. An illustration of the health monitoring system for which theprobe and the alignment fixture were developed is shown in FIG. 1.

FIG. 1 is a diagram that illustrates the health monitoring system andthe pulse echo method of measuring the condensed water height in a steampipe using time-of-flight of reflected ultrasonic waves.

In order to allow aligning the probe normal to the surface of potentialwater condensation and to secure intimate contract to the pipe surface anovel mounting fixture was conceived and developed.

FIG. 2A is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2B is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2C is a perspective view of the mounting strap for the alignmentand strapping the probe to the pipe surface in the field.

FIG. 2D is a perspective view of the probe alignment flexure.

FIG. 2E is a cutaway view of the probe alignment guide.

FIG. 3A is a perspective view of the probe and the connection fixturefor the mounting in the field.

FIG. 3B is a sectional view through the probe.

FIG. 3C is a cross-sectional plan view showing the preload offset.

FIG. 4A is an image of the pipe mounting strap elements.

FIG. 4B is an image of the pipe mounting strap elements and the halfpipe mounting strap and block.

FIG. 5 is an image of a mockup of a steam pipe with the strap and theprobe attached simulating operation in the field.

The pipe mount fixture comprises a probe alignment fixture and a strap.The strap includes a tension T-bolt with a spring for maintaining thetension in the strap even with large temperature variations and acoefficient of thermal expansion mismatch between the material of thesteam pipe and the strap material. The strap keeps the alignment fixturepressed against the pipe. The alignment fixture 200 includes a frame210, a probe alignment guide 220, two strap pins 230 and three alignmentbolts 240. The probe alignment guide 220 determines the axis of theprobe and is attached to the frame through parallel flexures 250. Theflexures 250 maintain the guide alignment with respect to the fixture200 and keep the probe in contact with the pipe. The strap pins 230allow the strap ends to be attached to the alignment fixture 200 andcontain a spherical surface for strap pin mounting. The three alignmentbolts 240 each have a sharp end. Their position in the alignment fixturecan be independently adjusted to align the fixture relative to the localvertical direction. The process of mounting the probe to the pipecomprises the following two steps:

Step 1: Attach the strap to the pipe and orient the probe alignmentflexure to the local vertical direction.

Step 2: Apply the bonding material onto the probe face, insert the probeinto the guide, press against the pipe and preload and secure the probebacking against the alignment guide.

When the health monitoring system is installed in the manhole, it isimportant to be able to align the probe without the presence of watersurface inside the pipe. For this purpose, the mounting fixture wasdesigned to allow for blind alignment capability. Three design optionsthat would allow for circumferential alignment as shown in FIG. 6.

FIG. 6A is an image of a sliding ball joint 610 for attaching themounting strap.

FIG. 6B is an image of a ball joint 620 for attaching the mountingstrap.

FIG. 6C is an image of a pin joint 630 with a spherical crowned surfacefor attaching the mounting strap.

After assessing the capability of these three designs the one that wechose is the configuration that is shown in FIG. 6A. It comprises a balljoint and slide.

The fixture was manufactured and is shown in FIG. 7A and FIG. 7B. FIG.7A is an image of a strap that has restricted circumferential alignmentcapability. FIG. 7B is another image of the strap shown in FIG. 7A.

Tests were made with the strap mounted on the pipe section and the probewas blindly aligned. Water was added gradually into the pipe andmeasurements were performed at every 0.25 inch until the water heightreached 1 inch, then the height was increased by 1 inch each time. Usingautocorrelation and a Hilbert transform the reflections from the 1 inchand higher were resolved quite easily. The highest water surfacereflection that was detected was at 9.375 inches and this proved thesuccess of the fixture capability. Determination of the height below 1inch is accomplished by reducing the signal duration (e.g., transmitshorter signals) which improves the probe resolution. Using the signalanalysis algorithms and the probe (made by NDT Transducers) at roomtemperature, the strapped probe performance was tested. The results arequite promising as shown in FIG. 8.

We now describe a high temperature ultrasonic pulse-echo probe that cansustain exposure to as high as 250° C. The probe was developed formeasuring in real-time the height of condensed water through the wall ofa steam pipe as part of a health monitoring system.

The ultrasonic pulse-echo probe allows for testing pipes at hightemperatures for nondestructive evaluation (NDE) and health monitoringapplications. The development of this probe was motivated by theobservation that no commercial probe that is reliable has been found inspite of numerous internet searches and company contacts. We identifiedmaterials that can sustain performance at high temperatures thatsupports this invention.

An effective in-service health monitoring system is needed to trackwater condensation in real-time through the wall of a steam pipes. Thesystem preferably is capable of measuring the height of the condensedwater from outside the pipe while operating at temperatures that are ashigh as 250° C. The system preferably needs to be able to account forthe effects of water flow and cavitation. In addition, it is desiredthat the system does not require perforating the pipes and therebyreducing their structural integrity.

The probe is an important part of a health monitoring of steam pipes. Anillustration of the health monitoring system for which the probe wasdeveloped is shown in FIG. 1. The general configuration of an ultrasonicprobe is schematically shown in FIG. 9.

A piezoelectric transducer is an important component in this ultrasonicsystem. It acts as both an ultrasonic transmitter and an ultrasonicreceiver. The relevant figure of merit of the piezoelectric transduceris electromechanical coupling factor as high-coupling piezoelectricsallow effective energy conversion in both transmitting and receivingenergy, improved bandwidth and sensitivity of the probe response. Foruse of the piezoelectric transducers at high temperature, other aspectsneed to be considered, such as phase transition, thermal aging,electrical resistivity, chemical stability (decomposition and defectcreation), and the stability of properties at elevated temperatures.Among these considerations, the phase transition at elevated temperatureis the most important limitation as the transducer is permanentlydepolarized at a certain temperature, known as the Curie point or Curietemperature, and cannot be used for transducer applications withoutbeing repoled. Although the piezoelectric materials that possess highCurie points greater than 500° C. are available, such as bismuth layerstructured ferroelectric (BLSF), lithium niobate (LiNbO₃) and Quartz,their transducer properties are considerably lower than conventionalpiezoelectric material, such as lead zirconate titanate (PZT). Inparticular, the health monitoring system working at high temperature(higher than 200° C., and preferably higher than 250° C.) requires highperformance piezoelectric transducers. Some of the factors thatpreferably should be taken into account include the effect of the pipewall curvature that causes ultrasonic wave losses and increasedattenuation at high temperatures. These effects can appreciably reducethe sensitivity, preventing the ultrasound wave from propagating throughmaterial media in steam pipe systems.

In order to meet the requirements of high Curie point and highpiezoelectric properties, a modified Navy type II piezoelectric material(known as PZT5A) was selected because this material family offers acombination of high piezoelectric properties and high Curie temperature.Based on the observed results, 2.25 MHz, modified type II, EC-64piezoelectric material and TRS203 piezoelectric material yieldsatisfactory probe bandwidth and sensitivity with high thermal stabilityup to 250° C. EC-64 is available from ITT Exelis -Acoustic Systems, 2645South 300 West, Salt Lake City, Utah 84115. It is described as follows:This “hard” lead zirconate titanate material was developed for generalpower applications. Having high electromechanical coupling, highpiezoelectric charge constant, and low dielectric loss under highelectric driving fields, it is suitable for high power, low frequencybroad band projectors, squeeze sensors, spark generators, and other highpower electro-acoustic devices. TRS203 is available from TRSTechnologies, Inc., 2820 E. College Avenue, Suite J, State College, Pa.16801.

The room temperature properties of these piezoelectric materials arelisted in Table 1. Although both ceramics showed similar transducerperformance below 250° C., TRS 203 ceramics possess higher transitiontemperature compared to conventional type II ceramics (see FIG. 10),allowing for sensing over a broader temperature range.

TABLE 1 Dielectric and electromechanical properties of EC-64 and TRS203piezoelectric materials. T_(C) c₃₃ ^(D) Transducer (° C.) ρ (g/cc) c(m/s) k_(t) ε₃₃ ^(T)/ε_(o) tanδ (GPa) EC-64 350 7.8 4452 0.45 1116 0.02154 TRS203 375 7.81 4547 0.45 1411 0.013 161

The parameters listed in Table 1 include T_(C) (Curie Temperature in °C.), ρ (density in grams/cc), c (speed of sound in meters/second), k_(t)(coupling coefficient in thickness dimension), ε₃₃ ^(T)/ε₀ (ratio of DCpermittivity to electric displacement), tan δ (dielectric loss factor orloss tangent) and c₃₃ ^(D) (elastic stiffness constant).

FIG. 10 is a graph that shows the temperature dependent dielectricproperties of conventional Type II and TRS203 ceramics. The data wasobtained from TRS Technologies Inc.

In one embodiment, a thick and high impedance layer, referred to asbacking, was attached on the back of the piezoelectric transducer. Thepurpose of this backing is to reduce the duration of the ringing inorder to be able resolve shallow water depths and have high resolution.However, an additional consequence is that it lowers the probesensitivity. Therefore, the appropriate selection of a backing layer isan important factor for the design of successful and efficientultrasound probes. Three different types of backing were used in thisstudy: (A) a high impedance polymer (e.g., a mixture of 20% of tungstenparticles and 80% of high temperature epoxy, available from Duralco4460, Cotronics Corp., 131 47th Street, Brooklyn, N.Y. 11232), (B) a lowimpedance polymer (Duralco 4460), and (C) no backing (air backing). Thegeneral properties of Duralco 4460 are listed in Table 2.

TABLE 2 Sample T_(m) (° C.) ρ (g/cc) c (m/s) α (*10⁵° C.) η (cps)Duralco4460 315 1.1 2200 5.4 600

The parameters listed in Table 2 include T_(m) (maximum usagetemperature), ρ (density), c (longitudinal sound velocity) α (thermalexpansion coefficient) and η (viscosity).

On the front surface of a piezoelectric material, a thin layer isgenerally added to protect the transducer surface from the wear andcorrosion when the probes are operating directly into high impedanceload, such as steel pipe (˜40 MRayl). The optimum impedance and ¼wavelength matching layer thickness of the front layer can be obtainedusing the following equations:

$\begin{matrix}{{Z_{m} = \sqrt{Z_{t}Z_{p}}},{t_{m} = \frac{v_{m}}{4f_{t}}}} & (1)\end{matrix}$where Z, f, t and v are acoustic impedance, operating frequency,thickness and sound velocity, respectively. The subscripts m, t, and prefer to matching layer, transducer layer and propagating medium,respectively.

Ultrasonic probe was assembled with the piezoelectric transducerattached to a corrosion resistant stainless steel housing using aninsulating commercial alumina adhesive paste (Resbond 989-FS, availablefrom Cotronics Corporation of Brooklyn, N.Y.). This ceramic adhesive canprovide high bond strength and excellent high temperature electrical,moisture, chemical and solvent resistance up to 1650° C. The transducerwas then electrically connected to a RG188 coaxial cable that cansustain temperatures much higher than 250° C. (CB-188LN-100, availablefrom CD International Technology, Inc., 3284 Edward Avenue, Suite C,Santa Clara, Calif. 95054). For soldering the wires, Ersin multi corehigh temperature solder (Ersin Multicore 366 Solder, available fromHenkel Loctite Corporation, 15051 E Don Julian Road, Industry, Calif.91746) that has melting point of about 400° C. was used. The rear faceof the housing was covered with aluminum using high temperature epoxy(Duralco 4460). Images of the fabricated ultrasonic probes that wereused for high temperature ultrasonic testing are shown in FIG. 11.

FIG. 11 is an image of two examples of the fabricated thickness modehigh temperature piezoelectric probe.

The performance of the fabricated ultrasonic probes was investigatedusing conventional pulse echo response measurements, in which thefabricated probes were placed in aluminum plate and excited by aPanametrics pulser/receiver (model 5052PR, Panametrics Inc., Waltham,Mass.). Note that the pulser setting is as follows: repetition rate: 4kHz; energy level: 1; attenuation: 20 and 2 dB step; high-pass filter: 1MHz; damping level 4; and −20 dB amplifier gain. The pulse echoresponses of the probes were recorded by receiving the reflected echousing a Tektronics model TDS2034B oscilloscope. FIG. 12A shows the timedomain pulse-echo waveforms and FIG. 12B shows the normalized frequencyspectrum for prepared ultrasonic probes A, B and C. Because of a heavybacking (Z_(b)=10 MRayl), probe A shows less ringing compared to probesB and C, leading to high-probe bandwidth on the order of 29.3%. Theshort pulse of a heavy backed probe is obtained because a heavy backinglayer dampens the piezoelectric transducer to shorten the pulse lengthand ring down. The signal amplitude of probe A is significantly lowerthan a light backed (B) and air backed probes (C) because a large amountof power is lost in the backing layer. Probe C exhibited the highestsignal amplitudes, being on the order of 0.54 V_(pp), which is an orderof magnitude higher than that of probe A, whose signal amplitude isaround 0.05 V_(pp). However, the pulse length and the bandwidth of theprobe were increased and decreased, respectively. The measuredproperties made from three different ultrasonic probes are summarized inTable 3.

TABLE 3 Measured acoustic performance for various ultrasonic probes.Probe A Probe B Probe C Z_(b) (Rayl) 10M 2M 400 F_(C) (Mhz) 2.4 2.2 2 BW(%) 29.3 16.9 23.18 V_(pp) 0.048 0.15 0.544

Z_(b) is backing material and F_(c) is center frequency BW is −6 dBbandwidth and V_(pp) is peak-to-peak voltage. M=10⁶.

A high temperature chamber (Blue M 6680, Signal Test, Inc. San Diego,Calif.) was used to test the probe and was operated up to 250° C.Because of size limitation of the chamber, a pipe was cut in half alongits length and part of the half pipe was used for high temperaturetesting. A picture of the pipe test bed is shown in FIG. 13. The pipewas filled with silicon oil (Clearco DPDM-400 Diphenyl-DimethylSilicone, Clearco Products Co., Inc. Bensalem, Pa.), which is able tosustain the temperatures from −20° C. to 250° C. Silicon oil was used asa substitute for condensed water in order to avoid safety issues relatedto steam and high pressure. The pulse echo responses of the probes weremonitored and recorded by receiving the reflected echo using aLabVIEW-controlled computer. Since the oil has low heat conduction,where the thermal conductivity of the oil is 3.2×10⁴ cal/cm/s/° C., athermocouple was inserted into the oil and tracked the temperature as itwas increased. The height of the silicon oil was measured while trackingthe temperature of the chamber.

FIG. 13 is an image of the high temperature (HT) test bed with saffloweroil where the probe was subjected to 250° C.

Various ultrasonic probe configurations were tested to determine theoptimum probe design. It was found that the reflected signals from theprobe A and B were too low to allow for good height measurementaccuracy. This is caused by a non-flat surface of the pipe, resulting ina large energy loss through the pipe wall. In addition, the silicon oilhas much higher attenuation of sound compared to water, where the roomtemperature attenuation (cm⁻¹) of water and silicon oil were reported tobe 23×10⁻¹⁷ ƒ² and 2×10 ⁻¹² ƒ^(1.7), respectively. In contrast, theair-backed probe showed a significant capability of transmitting andreceiving signals through a pipe wall at high temperature resulting fromthe much higher sensitivities compared to others. The results ofpulse-echo response using air-back probe at different temperatures areillustrated in FIG. 14A through FIG. 14F.

FIG. 14A through FIG. 14F are graphs of pulse-echo responses using anair-backed probe from the half steam pipe that contains silicon oil atvarious temperatures.

THEORETICAL DISCUSSION

Although the theoretical description given herein is thought to becorrect, the operation of the devices described and claimed herein doesnot depend upon the accuracy or validity of the theoretical description.That is, later theoretical developments that may explain the observedresults on a basis different from the theory presented herein will notdetract from the inventions described herein.

Any patent, patent application, patent application publication, journalarticle, book, published paper, or other publicly available materialidentified in the specification is hereby incorporated by referenceherein in its entirety. Any material, or portion thereof, that is saidto be incorporated by reference herein, but which conflicts withexisting definitions, statements, or other disclosure materialexplicitly set forth herein is only incorporated to the extent that noconflict arises between that incorporated material and the presentdisclosure material. In the event of a conflict, the conflict is to beresolved in favor of the present disclosure as the preferred disclosure.

While the present invention has been particularly shown and describedwith reference to the preferred mode as illustrated in the drawing, itwill be understood by one skilled in the art that various changes indetail may be affected therein without departing from the spirit andscope of the invention as defined by the claims.

What is claimed is:
 1. A high-temperature ultrasonic probe, comprising:a piezoelectric transducer element having a Curie temperature of atleast 350° C. and a mechanical damping (tan δ) of 0.02 or less;electrical input terminals configured to receive a driving signal tosaid piezoelectric transducer element; electrical output terminalsconfigured to provide a response signal from said piezoelectrictransducer element; a preload flexure; and a probe housing.
 2. Thehigh-temperature ultrasonic probe of claim 1, wherein saidhigh-temperature ultrasonic transducer is configured to performpulse-echo measurements at a frequency of 2.25 MHz or higher.
 3. Thehigh-temperature ultrasonic probe of claim 1, wherein said piezoelectrictransducer element is configured to act as both an ultrasonictransmitter and an ultrasonic receiver.
 4. The high-temperatureultrasonic probe of claim 1, further comprising a backing.
 5. Thehigh-temperature ultrasonic probe of claim 4, wherein said backing isconfigured to reduce the duration of a ringing in said piezoelectrictransducer element.
 6. The high-temperature ultrasonic probe of claim 4,wherein said backing is a selected one of air, a high impedance polymerand a low impedance polymer.
 7. The high-temperature ultrasonic probe ofclaim 1, further comprising a preload offset.
 8. The high-temperatureultrasonic probe of claim 1, further comprising a pulser/receiver andamplifier.
 9. The high-temperature ultrasonic probe of claim 1, furthercomprising a digital signal processor.
 10. The high-temperatureultrasonic probe of claim 1, further comprising a wireless communicationmodule.
 11. A mounting fixture for attaching a high-temperatureultrasonic probe to a steam pipe, comprising: a frame; a probe alignmentguide connected to said frame by way of a plurality of flexures; twostrap pins attached to said frame; three alignment bolts attached tosaid frame; and a strap, wherein the high temperature ultrasonic probecomprises: a piezoelectric transducer element having a Curie temperatureof at least 350° C. and a mechanical damping (tan δ) of 0.02or less;electrical input terminals configured to receive a driving signal tosaid piezoelectric transducer element; electrical output terminalsconfigured to provide a response signal from said piezoelectrictransducer element; a preload flexure; and a probe housing.
 12. Themounting fixture for attaching a high-temperature ultrasonic probe to asteam pipe of claim 11, wherein said probe alignment guide is configuredto determine an axis of the high-temperature ultrasonic probe.
 13. Themounting fixture for attaching a high-temperature ultrasonic probe to asteam pipe of claim 11, wherein said plurality of flexures areconfigured to keep said high-temperature ultrasonic probe in contactwith said steam pipe.
 14. The mounting fixture for attaching ahigh-temperature ultrasonic probe to a steam pipe of claim 11, whereinsaid plurality of flexures are configured to keep the orientation ofsaid probe alignment guide constant while preloading thehigh-temperature ultrasonic probe against the pipe and throughtemperature variations of the high-temperature ultrasonic pipe andenvironment.
 15. The mounting fixture for attaching a high-temperatureultrasonic probe to a steam pipe of claim 11, wherein said strap pinscontain a spherical surface for strap pin mounting.
 16. The mountingfixture for attaching a high-temperature ultrasonic probe to a steampipe of claim 11, wherein said strap pins comprise a selected one of apin joint, a ball joint and a sliding ball joint.
 17. The mountingfixture for attaching a high-temperature ultrasonic probe to a steampipe of claim 11, wherein said three alignment bolts each have a sharpend.
 18. The mounting fixture for attaching a high-temperatureultrasonic probe to a steam pipe of claim 11, wherein said threealignment bolts are configured to be independently adjusted to alignsaid mounting fixture relative to a local preferred direction.
 19. Themounting fixture for attaching a high-temperature ultrasonic probe to asteam pipe of claim 11, wherein said local preferred direction is alocal vertical direction.